Technical Specifications
Comprehensive material properties and performance data for our ≥99.99% high-purity quartz glass. Engineered for ultimate precision and reliability across extreme semiconductor, optical, and high-temperature industrial environments.
Material Properties Overview
Our ultra-pure quartz glass exhibits exceptional thermodynamic stability across all critical parameters. Manufactured from premium natural quartz crystals using advanced fusion techniques, our material delivers consistent, reliable performance for high-end fabrication processes. Below are the detailed material specifications verified through rigorous laboratory testing protocols.
Physical & Mechanical Properties
Quartz glass exhibits superior mechanical strength and dimensional stability. The low density combined with high hardness makes it ideal for precision components requiring minimal weight and maximum durability.
| Property | Value |
|---|---|
| Mohs Hardness | 5.5 – 6.5 |
| Compressive Strength | 1100 MPa |
| Flexural Strength (20°C) | 67 MPa |
| Tensile Strength | 48 MPa |
| Young’s Modulus (20°C) | 72 GPa |
| Shear Modulus | 31 GPa |
| Bulk Modulus | 37 GPa |
| Poisson’s Ratio | 0.17 |
| Density (20°C) | 2.2 g/cm³ |
Thermal Properties
Exceptional thermal shock resistance and a near-zero thermal expansion coefficient make quartz glass ideal for rapid temperature cycling applications. It can withstand dramatic shifts from 1200°C to room temperature without catastrophic failure.
| Property | Value |
|---|---|
| Annealing Point | ≈ 1215 °C |
| Strain Point | ≈ 1120 °C |
| Max. Working Temp (Continuous) | 1200 °C |
| Max. Working Temp (Short Term) | 1300 °C |
| Thermal Expansion (20-300°C) | 5.5 × 10⁻⁷ /°C |
| Thermal Conductivity (20°C) | 1.4 W/(m·K) |
| Specific Heat (20°C) | 670 J/(kg·K) |
| Thermal Diffusivity (20°C) | 9.5 × 10⁻⁷ m²/s |
| Softening Point | ≈ 1680 °C |
Electrical Properties
Excellent electrical insulation properties with high resistivity and ultra-low dielectric loss. Indispensable for high-frequency applications and electrical isolation in semiconductor processing equipment.
| Property | Value |
|---|---|
| Resistivity (at 20°C) | > 10¹⁸ Ω·cm |
| Resistivity (at 350°C) | 7 × 10⁷ Ω·cm |
| Dielectric Constant (1 MHz, 20°C) | 3.75 |
| Dielectric Strength | 25 – 40 kV/mm |
| Dielectric Loss Factor (1 MHz) | < 1 × 10⁻⁴ |
| Dielectric Loss Factor (1 GHz) | < 6 × 10⁻⁴ |
Optical Properties
Unrivaled UV transmission and optical clarity make fused silica a staple for spectroscopy, laser optics, and deep-UV applications. High chemical purity ensures minimal light absorption and scattering.
| Property | Value |
|---|---|
| Refractive Index (589 nm, 20°C) | 1.4585 |
| Refractive Index (1060 nm) | 1.4496 |
| Transmission Range | 185 – 2500 nm |
| UV Transmission (254 nm, 10mm) | > 90% |
| Abbe Number | 67.8 |
| Stress Optical Coefficient | 3.5 × 10⁻⁶ MPa⁻¹ |
Chemical Composition & Purity
Ultra-high purity with meticulously controlled metallic impurities ensures zero contamination during sensitive wafer fabrication. Material composition is strictly verified for every production batch.
| Property | Value |
|---|---|
| SiO₂ Content | ≥ 99.99% |
| OH Content | < 10 ppm |
| Al Impurity | < 10 ppm |
| Fe Impurity | < 5 ppm |
| Na + K Impurities | < 5 ppm |
| Total Metal Impurities | < 20 ppm |
| Acid Resistance | Excellent |
Additional Properties
Comprehensive material characteristics covering acoustic transmission, radiation resistance, and vacuum surface integrity essential for specialized industrial processes.
| Property | Value |
|---|---|
| Acoustic Velocity (Longitudinal) | 5968 m/s |
| Acoustic Velocity (Transverse) | 3764 m/s |
| Radiation Resistance | Good |
| Permeability (He at 700°C) | Low |
| Surface Energy | ≈ 300 mJ/m² |
| Outgassing Rate (Vacuum) | Very Low |
Material Performance Comparison
Understanding how high-purity quartz glass compares to other advanced engineering materials is critical for optimal equipment design. While alternatives like Borosilicate or Alumina Ceramic have their uses, Fused Silica remains the only material capable of simultaneously delivering ultra-high purity, deep-UV optical transmission, and extreme thermal shock resistance in one monolithic structure.
| Feature / Property | High-Purity Quartz Glass | Borosilicate Glass (e.g., Pyrex) | Alumina Ceramic (Al₂O₃) |
|---|---|---|---|
| Purity / Cleanroom Grade | Ultra-High (≥ 99.99% SiO₂) Zero shedding; ideal for semiconductor. | Medium (~80% SiO₂ + Boron) Contains trace alkalis. | High (99.5%) Porous structure; prone to particle shedding. |
| Max Continuous Temp (°C) | 1200 °C | 500 °C | 1600 °C |
| Thermal Expansion (×10⁻⁶/K) | 0.55 (Near-Zero) Immune to severe thermal shock. | 3.3 Vulnerable to rapid heating/cooling. | 7.2 High expansion; requires slow heat cycles. |
| Optical Transmission | Deep UV through Near-IR Excellent clarity for lasers and optics. | Visible Light Only Opaque to UV spectrum. | Opaque Zero optical transmission. |
| Formability / Welding | Outstanding Can be seamlessly flame-welded and CNC milled. | Good Easy to mold but limited to low-temp. | Very Poor Must be sintered; cannot be seamlessly welded. |