Applications / Semiconductor
Semiconductor Quartz Glass
High-purity fused silica for front-end wafer processing
Process tubes, wafer boats, gas injectors, furnace liners, wet-bench vessels and fully custom quartzware — engineered for diffusion, oxidation, LPCVD, annealing and cleaning in modern fabs. Ultra-low metallic impurities, thermal-shock resistance and dimensional stability under repeated furnace cycles. Engineering quote within 24 business hours.
SiO₂ purity
≥ 99.99 %
Wafer size
2″–12″
Facility
ISO 9001
1 pc
Minimum custom prototype
Since 2005
Semiconductor supply
H · V
Horizontal & vertical furnaces
15 000 m²
ISO 9001 plant, Lianyungang
Clear · Opaque
Pyrometry or insulation
Why quartz in the fab
Every wafer passes through high-purity fused silica
In semiconductor fabrication, every wafer goes through multiple high-temperature and chemical steps. High-purity fused silica is the material of choice because no other practical material simultaneously delivers extreme thermal stability, near-zero thermal expansion under repeated furnace cycles, near-total chemical inertness to process gases and wet chemicals, and inherent purity that prevents metallic contamination of the silicon lattice.
Alumina and silicon carbide match some of these properties individually, but not all together at the cost point fused silica delivers. Borosilicate covers only a fraction of the temperature range. Above roughly 800 °C in front-end thermal tools, quartz glass remains the default process chamber and wafer-contact material.
Purity
Protect the silicon lattice
SiO₂ ≥ 99.99 % with tightly controlled metallic impurities. Low alkali and transition-metal content reduces the risk of contamination during oxidation, diffusion and LPCVD.
Geometry
Survive thousands of cycles
Near-zero expansion (5.5 × 10⁻⁷ /°C) keeps boat slots and tube concentricity stable from room temperature to process temperature — critical for robot load, gas uniformity and film yield.
Product range
Complete front-end semiconductor quartzware
Process tubes, wafer boats, injectors, liners, wet-bench vessels and custom fixtures — for horizontal and vertical platforms, standard geometries and build-to-print designs.
Thermal chamber
Process & Diffusion Tubes
The core of every thermal furnace stack. Clear and opaque grades for horizontal and vertical configurations. Used in oxidation, diffusion, annealing and LPCVD. Custom flanges, end treatments and diameters to match the furnace platform.
Ends: Plain · flanged · ground sealing faces
Wafer carrier
Semiconductor Wafer Boats
Precision carriers for 2-inch to 12-inch (100–300 mm) wafers. Low particle generation, uniform heating and long service life. Slot geometry, pitch and capacity customized to the tool and process recipe.
Capacity: 25 / 50 / 100 / 150+ slots · sleds & paddles available
Gas delivery
Gas Injectors & Nozzles
High-purity injectors that deliver process gas uniformly into the furnace tube. Critical for film and dopant uniformity in CVD and diffusion. Single-lance, multi-hole and injector-ring designs to drawing.
Features: Hole pattern · pitch · clocking · insertion depth
Thermal management
Furnace Liners & Pedestals
Protective liners and support components that extend process-tube life and improve thermal uniformity. Opaque grade for insulation; clear where optical access is required.
Use: Heat shielding · tube protection · support structures
Wet process
Wet Bench & Cleaning Components
Quartz tanks, boats, carriers and vessels for wet cleaning, etching and stripping. High chemical resistance to acids and cleaning solutions with minimal metallic contribution to the bath.
Scope: Tanks · carriers · vessels · overflow / drain features
Build-to-print
Custom Semiconductor Quartzware
Fully custom parts to drawing or reverse-engineered from samples: push paddles, end caps, baffles, thermocouple sheaths, flanges and specialized process fixtures.
Input: DXF · STEP · IGES · sample for CMM reverse engineering
Process modules
Quartz across key front-end modules
The same material family serves thermal, CVD and wet modules — only geometry, grade and surface finish change with the process.
Diffusion & Oxidation
High-temperature dopant introduction and SiO₂ growth. Process tubes, wafer boats and gas injectors must hold purity and geometry through repeated thermal cycles. Sag resistance and slot stability directly affect wafer-to-wafer uniformity.
LPCVD & PECVD
Chemical vapour deposition of polysilicon, silicon nitride and oxide. Quartz provides a clean high-temperature environment with excellent process-gas compatibility. Injector hole patterns and boat design influence film thickness uniformity along the load.
Annealing & RTP
Thermal annealing and rapid thermal processing require precise temperature control and low contamination. Quartz boats and support structures enable uniform heating; clear windows support pyrometry where optical access is required.
Wet Cleaning & Etching
Acid and solvent-based cleaning steps. High-purity quartz tanks, carriers and vessels resist chemical attack while minimizing metallic contamination of the wafer and the bath chemistry.
Clear vs opaque
Choose the grade for the thermal role
Clear and opaque fused silica serve different functions in the same furnace stack. Choosing the wrong grade produces temperature non-uniformity or blocks optical access.
Clear fused silica
Pyrometry · optical access
Transmits visible, UV and IR. Used for process tubes where in-situ pyrometry reads through the wall, RTP windows and UV lamp envelopes.
Opaque fused silica
Insulation · heat shielding
Microscopic closed voids scatter and absorb light, lowering thermal emissivity. Used for furnace liners, baffles and spacers where heat retention is required.
Material advantages
SiO₂ purity≥ 99.99 %
Metallic impuritiesTightly controlled
Thermal expansion (20–300 °C)5.5 × 10⁻⁷ /°C
Continuous service1 200 °C
Thermal shock resistanceExcellent
Process gas / wet chemical resistanceOutstanding
Particle generation (proper finish)Low
GradesClear & opaque
Fabrication
Drawn, CNC-machined and flame-worked under one roof
Semiconductor quartzware is produced in the same 15 000 m² ISO 9001 facility that supplies optical and high-temperature products. Tube drawing, CNC diamond machining, oxy-hydrogen flame forming, fire polish and annealing stay under one quality system — important when a matched set of tube, boat and injector must ship together.
Contact surfaces on boats and injectors can be fire-polished to reduce particle generation. Slot pitch, parallelism and bow are verified by dimensional metrology before shipment.
01
Precision tube production
Process tubes drawn with controlled diameter, wall thickness and concentricity for horizontal and vertical furnace systems.
02
CNC diamond machining
Wafer boats, injectors, pedestals and complex fixtures machined to tight tolerances with fire-polished contact surfaces.
03
Oxy-hydrogen flame forming
Flanged tubes, multi-port injectors, closed assemblies and specialized geometries — annealed for stress relief under thermal cycling.
04
Metrology & clean finish
Slot pitch, parallelism, bow and surface condition verified. CoC and material documentation available on request.
Custom solutions
When the catalogue part does not fit the tool
New furnace platforms, legacy tools without drawings, and process changes that alter boat pitch or injector hole patterns all require custom quartzware. FGQuartz accepts formal drawings (DXF, STEP, IGES, PDF) and also reverse-engineers from physical samples measured on a coordinate measuring machine.
Prototype quantities down to a single piece are accepted. Once the prototype is approved, production quantities follow the same machining programme with no additional qualification lead time for geometry. Engineering feedback on manufacturability is normally returned within 24 business hours of receiving a drawing or sample.
FAQ
Questions process and procurement actually ask
Clear vs opaque, drawings vs samples, product scope and why quartz over alternatives. If the answer is not here, put it on the RFQ.
Clear fused silica transmits visible, UV, and infrared light. It is used for process tubes where in-situ pyrometry reads through the tube wall, for RTP windows, and for UV lamp envelopes. Opaque quartz contains microscopic closed voids that scatter and absorb light, giving it much lower thermal emissivity. It behaves as a thermal insulator and is used for furnace liners, baffles, and spacers where heat shielding is required. Choosing the wrong grade leads to unexpected temperature non-uniformity: a clear tube where an opaque liner is needed allows heat to escape to the furnace body; an opaque tube where optical access is needed blocks the pyrometer signal entirely.
Yes. FGQuartz accepts drawings in DXF, STEP, or IGES formats. For customers who do not have drawings — for example, when replicating a worn-out legacy component whose original drawings are unavailable — the sample part is measured on a coordinate measuring machine and a new production drawing is created in-house. Prototype quantities down to a single piece are accommodated. Once the prototype is approved, production quantities follow the same machining programme with no additional qualification lead time.
FGQuartz manufactures the complete range of front-end quartzware: process tubes and diffusion tubes in both horizontal and vertical configurations; wafer boats and carriers for 100 mm through 300 mm wafer generations; gas injectors and injector rings for LPCVD and CVD furnaces; flanges, endcaps, and push rods; furnace liners in clear and opaque grades; quartz tanks and wet-bench vessels; thermocouple protection tubes; and fully custom CNC-machined parts produced to customer drawings or reverse-engineered from sample components.
Quartz glass combines properties that no other common material matches simultaneously: extreme thermal stability, near-zero thermal expansion to survive repeated furnace cycles without cracking, near-total chemical inertness against the acids and process gases used in wafer processing, and inherent high purity that prevents metallic contamination of the silicon lattice. Alumina and silicon carbide match some of these individually but not all together at the cost point that fused silica delivers. Borosilicate glass covers a fraction of the temperature range. Quartz glass is the only practical choice for front-end furnace environments above approximately 800 °C.
RFQ
Source semiconductor quartz for your fab or tool
Tell us furnace platform, wafer size, process type (diffusion, oxidation, LPCVD, anneal, wet) and required components. DXF, STEP, IGES, a dimensioned sketch or a sample for reverse engineering are enough to start. Prototype quantity: one piece.
- Quote within 24 business hours
- File formats: DXF, STEP, IGES, PDF
- Clear and opaque grades
- Horizontal and vertical furnace geometries
- Prototype through production volume
